 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| INTEGRATED CIRCUITS DATA SHEET TDA7056AT 3 W mono BTL audio amplifier with DC volume control Product specification File under Integrated Circuits, IC01 1998 Feb 23 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control FEATURES * DC volume control * Few external components * Mute mode * Thermal protection * Short-circuit proof * No switch-on or switch-off clicks * Good overall stability * Low power consumption * Low HF radiation * ESD protected on all pins. QUICK REFERENCE DATA SYMBOL VP Po Gv(max) Gv Iq(tot) THD PARAMETER supply voltage output power maximum total voltage gain voltage gain control range total quiescent current total harmonic distortion VP = 12 V; RL = Po = 0.5 W VP = 12 V; RL = 16 VP = 12 V; RL = 16 CONDITIONS 3 34.5 75 - - MIN. 4.5 - 3.5 35.5 80 8 0.3 TYP. GENERAL DESCRIPTION TDA7056AT The TDA7056AT is a mono Bridge-Tied Load (BTL) output amplifier with DC volume control. It is designed for use in TVs and monitors, but is also suitable for battery-fed portable recorders and radios. The device is contained in a 20-lead small outline package. A Missing Current Limiter (MCL) is built in. The MCL circuit is activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (300 mA typ.). This level of 100 mA allows for Single-Ended (SE) headphone applications. MAX. 18 - 36.5 - 16 1 UNIT V W dB dB mA % ORDERING INFORMATION TYPE NUMBER TDA7056AT PACKAGE NAME SO20 DESCRIPTION plastic small outline package with 20 leads; body width 7.5 mm VERSION SOT163-1 1998 Feb 23 2 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control BLOCK DIAGRAM TDA7056AT handbook, full pagewidth n.c. VP 1 to 3, 8 to 13, 16, 18 to 20 4 TDA7056AT positive input DC volume control 5 7 I+i 14 + positive output + - I-i + Vref STABILIZER TEMPERATURE PROTECTION 17 - negative output 6 15 MGM576 signal ground power ground Fig.1 Block diagram. 1998 Feb 23 3 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control PINNING SYMBOL n.c. n.c. n.c. VP VI GND1 VC n.c. n.c. n.c. n.c. n.c. n.c. OUT+ GND2 n.c. OUT- n.c. n.c. n.c. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION not connected not connected not connected positive supply voltage positive input signal ground DC volume control not connected not connected not connected not connected not connected not connected positive output power ground not connected negative output not connected not connected not connected n.c. 9 n.c. 10 MGM577 TDA7056AT handbook, halfpage n.c. 1 n.c. 2 n.c. 3 VP 4 VI 5 20 n.c. 19 n.c. 18 n.c. 17 OUT- 16 n.c. TDA7056AT GND1 6 VC 7 n.c. 8 15 GND2 14 OUT+ 13 n.c. 12 n.c. 11 n.c. Fig.2 Pin configuration. 1998 Feb 23 4 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control FUNCTIONAL DESCRIPTION The TDA7056AT is a mono BTL output amplifier with DC volume control. It is designed for use in TVs and monitors but is also suitable for battery-fed portable recorders and radios. In conventional DC volume circuits the control or input stage is AC-coupled to the output stage via external capacitors to keep the offset voltage low. In the TDA7056AT the DC volume control stage is integrated into the input stage so that no coupling capacitors are required. With this configuration, a low offset voltage is still maintained and the minimum supply voltage remains low. The BTL principle offers the following advantages: * Lower peak value of the supply current * The frequency of the ripple on the supply voltage is twice the signal frequency. Consequently, a reduced power supply with smaller capacitors can be used which also results in cost reductions. For portable applications there is a trend to decrease the supply voltage, resulting in a reduction of output power at conventional output stages. Using the BTL principle increases the output power. TDA7056AT The maximum gain of the amplifier is fixed at 35.5 dB. The DC volume control stage has a logarithmic control characteristic. The total gain can be controlled from +35.5 to -44 dB. If the DC volume control voltage is below 0.3 V, the device switches to the mute mode. The amplifier is short-circuit proof to ground, VP and across the load. A thermal protection circuit is also implemented. If the crystal temperature rises above +150 C the gain will be reduced, thereby reducing the output power. Special attention is given to switch-on and switch-off clicks, low HF radiation and a good overall stability. Power dissipation Assume VP = 12 V; RL = 16 . The maximum sine wave dissipation is 1.8 W. The Rth vj-a of the package is 60 K/W. Therefore Tamb(max) = 150 - 60 x 1.8 = 42 C. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP V5, 7 IORM IOSM Ptot Tamb Tstg Tvj tsc PARAMETER supply voltage input voltage pins 5 and 7 repetitive peak output current non-repetitive peak output current total power dissipation operating ambient temperature storage temperature virtual junction temperature short-circuit time Tcase < 60 C CONDITIONS - - - - - -40 -55 - - MIN. 5 1.25 1.5 1.5 +85 +150 150 1 MAX. 18 UNIT V V A A W C C C h THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 60 UNIT K/W 1998 Feb 23 5 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT CHARACTERISTICS VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.14). SYMBOL Supply VP Iq(tot) supply voltage total quiescent current RL = ; note 1 THD = 10%; RL = 16 Po = 0.5 W VVC = 0.8 V; THD < 1% f = 500 kHz; note 2 at -1 dB note 3 V17 - v14 4.5 - - 8 18 16 - 1 36.5 - - - - 150 25 - 30 V mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Maximum gain (V7 = 1.4 V) Po THD Gv(max) Vi(rms) Vn(o)(rms) B SVRR VOS Zi output power total harmonic distortion maximum total voltage gain input signal handling (RMS value) noise output voltage (RMS value) bandwidth supply voltage ripple rejection DC output offset voltage input impedance (pin 3) 3 - 34.5 0.5 - - 38 - 15 - note 4 VVC 0.3 V; VI = 600 mV; note 4 - - 3.5 0.3 35.5 0.65 210 0.02 to 300 46 0 20 -44 20 W % dB V V kHz dB mV k Minimum gain (V7 = 0.5 V) Gv Vo(n)(rms) Vo(mute) voltage gain noise output voltage (RMS value) dB V V Mute position output voltage in mute position 35 45 DC volume control Gv IVC Notes 1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being equal to the DC output offset voltage divided by RL. 2. The noise output voltage (Vn(o)(rms)) at f = 500 kHz, is measured with Rs = 0 and B = 5 kHz. 3. The ripple rejection is measured with Rs = 0 and f = 100 Hz to 10 kHz. The ripple voltage (Vripple = 200 mV RMS) is applied to the positive supply rail. 4. The noise output voltage (Vn(o)(rms)) is measured with Rs = 5 k unweighted. voltage gain control range control current VVC = 0 V 75 60 80 70 - 80 dB A 1998 Feb 23 6 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT MGM578 handbook, halfpage 20 Iq handbook, halfpage (mA) 16 12 THD (%) 10 MGM579 8 12 6 8 4 4 2 (1) 0 0 4 8 12 16 VP (V) 20 0 10-1 1 Po (W) 10 V5 = 1.4 V; no load. VDC = 1.4 V. (1) VP = 12 V; RL = 16 . Fig.3 Quiescent current as a function of the supply voltage. Fig.4 THD as a function of output power. handbook, halfpage 8 MGM580 handbook, halfpage 100 MGM581 THD (%) 6 RR (dB) 80 (1) 60 (2) 4 40 2 20 (1) (3) 0 10 102 103 104 f (Hz) 105 0 10 102 103 104 f (Hz) 105 VP = 12 V, Po = 0.5 W, VDC = 1.4 V. (1) RL = 16 . VP = 12 V; RL = 16 ; Vr = 200 mV. (1) V7 = 0.3 V; Rs = 5 k. (2) V7 = 1.4 V; Rs = 0 . (3) V7 = 1.4 V; Rs = 5 k. Fig.5 THD as a function of frequency. Fig.6 Ripple rejection as a function of frequency. 1998 Feb 23 7 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT MGM582 MGM583 handbook,40 halfpage gain (dB) handbook, halfpage 1000 Vn (V) 800 20 0 600 -20 400 -40 -60 -80 200 0 0 0.4 0.8 1.2 1.6 V7 (V) 2.0 0 0.4 0.8 1.2 1.6 V7 (V) 2.0 Measured with Rs = 5 k unweighted; f = 22 Hz to 22 kHz. Fig.7 Gain control as a function of DC volume control. Fig.8 Noise output voltage as a function of DC volume control. MGM584 MGM585 handbook, halfpage 1000 Vi 800 handbook, halfpage 5 (mV) Po (W) 4 600 3 (1) (2) (3) 400 2 200 1 0 0 4 8 12 16 VP (V) 20 0 0 4 8 12 16 VP (V) Measured at THD = 10%. The maximum output power is limited by the maximum power dissipation and the maximum available output current. (1) RL = 8 . (2) RL = 16 . (3) RL = 25 . 20 Tamb = 25 C; THD = 1%; RL = 16 ; VDC = 0.8 V. Fig.9 Input signal handling as a function of the supply voltage. Fig.10 Output power as a function of the supply voltage. 1998 Feb 23 8 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT handbook, halfpage 3 MGM586 MGM587 handbook, halfpage 100 P (W) 2 (1) (2) (3) I5 (A) 60 20 -20 1 -60 0 0 4 8 12 16 VP (V) (1) RL = 8 . (2) RL = 16 . (3) RL = 25 . 20 -100 0 0.4 0.8 1.2 1.6 V7 (V) 2.0 Fig.11 Total worst case power dissipation as a function of supply voltage. Fig.12 Control current as a function of DC volume control. 1998 Feb 23 9 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT handbook, full pagewidth a. Top view of bottom copper. GND +VP 220 F 100 nF 0.47 F 1 5 k IN -OUT 20 TDA7056A/BT +OUT 100 nF D&A AUDIO POWER CIC NIJMEGEN volume MGM591 b. Top view of component side. Fig.13 Printed-circuit board layout. 1998 Feb 23 10 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TEST AND APPLICATION INFORMATION Test conditions Tamb = 25 C if not specified: VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; audio bandpass: 22 Hz to 22 kHz. In Figures 5 and 6 a low-pass filter of 80 kHz was applied. It should be noted that capacitive loads (100 pF and 5 nF) connected between the output pins to a common ground can cause oscillations. The BTL application circuit diagram is shown in Fig.14. To avoid instabilities and too high distortion, the input and power ground traces must be separated as far as possible and connected together as close as possible to the IC. The quiescent current has been measured without load impedance. Voltage gain The maximum closed-loop voltage gain has been internally fixed at 35.5 dB. The input sensitivity at maximum gain for Po = 3 W (RL = 16 ) is 115 mV. The gain bandwidth is 20 Hz to 300 kHz within 1 dB. Output power The output power as a function of supply voltage has been measured at THD = 10%. The maximum output power is limited by the maximum allowed power dissipation at Tamb = 25 C approximately 2 W, and the maximum available output current is 1.25 A repetitive peak current. Switch-on/switch-off The switch-on behaviour depends on the following: * The rise time of the power supply (if tr > 40 ms for VP = 0 to 12 V then the switch-on behaviour will be good) * The input capacitor and source impedance (a higher source impedance and/or lower input capacitor value will have a positive influence on the switch-on/switch-off behaviour) * The DC volume control pin (a capacitor of >0.1 F avoids disturbances). Thermal behaviour: TDA7056AT The measured thermal resistance of the IC package is highly dependent on the configuration and size of the application board. Data may not be comparable between different semiconductors manufacturers because the application boards and test methods are not (yet) standardized. The thermal performance of packages for a specific application may also be different than presented here, because the configuration of the application boards (copper area) may be different. Philips Semiconductors uses FR-4 type application boards with 1 oz copper traces with solder coating. The measurements have been carried out with vertical placed boards. Using a practical PCB layout with wider copper tracks and some copper area to the IC pins and just under the IC, the thermal resistance from junction to ambient can be reduced. In the demonstration application PCB the Rth(j-a) = 56 K/W for the SO20 plastic package. For a maximum ambient temperature of Tamb = 50 C the following calculation can be made for the maximum power ( 150 K/W - 50 K/W ) dissipation: ------------------------------------------------------ = 1.79 W 56 K/W For the application at VP = 12 V and RL = 16 the worst case sine wave dissipation is 1.85 W. Because in practice the `music-power' causes about the half of the sine wave dissipation, this application (VP = 12 V; RL = 16 ) has been allowed. Short-circuit protection: The output pins (pins 14 and 17) can be short-circuited to ground respectively to +VP. The Missing Current Limiter (MCL) protection circuit will shut-off the amplifier. Removing the short-circuit will reset the amplifier automatically. Short-circuit across the load (pins 14 and 17) will activate the thermal protection circuit; this will result in reducing the short-circuit current. 1998 Feb 23 11 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT handbook, full pagewidth (1) VP 220 F 100 nF n.c. 1 to 3, 8 to 13, 16, 18 to 20 4 0.47 F positive input TDA7056AT 5 7 I+i 14 + + - I-i + 17 RL = 16 - Rs 5 k DC volume control Vref STABILIZER TEMPERATURE PROTECTION 6 15 MGM588 ground To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as possible to the IC. (1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2. Fig.14 Test and application diagram. For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit protection (MLC) will be activated. 1998 Feb 23 12 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control TDA7056AT handbook, halfpage handbook, halfpage VP = 12 V 82 k volume control 7 1 F 100 k GND MGM589 TDA7056AT 1 F 22 k 7 TDA7056AT GND volume control MGM590 Fig.15 Application with potentiometer as volume control; maximum gain = 30 dB. Fig.16 Application with potentiometer as volume control; maximum gain = 36 dB. 1998 Feb 23 13 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control PACKAGE OUTLINE SO20: plastic small outline package; 20 leads; body width 7.5 mm TDA7056AT SOT163-1 D E A X c y HE vMA Z 20 11 Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 8o 0o ISSUE DATE 95-01-24 97-05-22 1998 Feb 23 14 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering TDA7056AT Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 1998 Feb 23 15 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA7056AT This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Feb 23 16 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control NOTES TDA7056AT 1998 Feb 23 17 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control NOTES TDA7056AT 1998 Feb 23 18 Philips Semiconductors Product specification 3 W mono BTL audio amplifier with DC volume control NOTES TDA7056AT 1998 Feb 23 19 Philips Semiconductors - a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998 Internet: http://www.semiconductors.philips.com SCA57 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 545102/25/01/pp20 Date of release: 1998 Feb 23 Document order number: 9397 750 03253 |
Price & Availability of TDA7056AT
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |